design ball grid

  • The Many Flavors of Ball Grid Array Packages | Electronics ...

    Ball Matrix. Typically the balls are on a rectangular grid. The ball matrix indicates the number of balls along two adjacent outer rows from corner to corner. For example, a package with a 26 x 26 ball matrix would have 26 balls on each outer row, a so-called "square" matrix.

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  • Registered Outlines: JEP95 | JEDEC

    JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions.

  • Ball grid array - Wikipedia

    A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.BGA packages are used to permanently mount devices such as microprocessors.A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.The whole bottom surface of the device can be used, instead of just the perimeter.